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F&S BONDTEC Semiconductor GmbH

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Benefit from our enormous amount of knowledge on the subject of wire bonding.

Company profile

F&S BONDTEC serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S BONDTEC can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.

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F&S BONDTEC Semiconductor GmbH
Industriezeile 49a, 5280 Braunau, Austria
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