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Up-to-date ultrasound technology for chip bonding and the semiconductor industry

Company profile

F&K Physiktechnik GmbH, with more than 21 years of experience in the development and manufacture of products and processes for chip contacting in microelectronics, is the system supplier for all users of ultrasonic bonding technology. Customers worldwide use the generators and transducers of F&K Physiktechnik to realize their projects in ultrasonic wire and ultrasonic die bonding. In addition, we offer test and measurement equipment for characterization and setup of ultrasonic systems of bonding machines

Product range and services:
Ultrasonic transducers (standard / custom), ultrasonic generators (standard / custom), optical vibration amplitude measurement systems (vibrometers), bond force calibration systems, vibration measurements (on-site and in-house)

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