DIVE imaging systems GmbH
DIVE into Hyperspectral Vision. Comprehend the invisible.
Company profile
DIVE imaging systems GmbH opens a new chapter of quality control in semiconductor manufacturing with its Hyperspectral Vision system solutions. The Hyperspectral Vision Devices enable non-invasive, non-contact, two-dimensional measurements of wafer surfaces and their thin film topology, for both micro and macro inspection.
As a spin-off of the Fraunhofer IWS, DIVE synergetically combines hardware, software and AI-based algorithms to create unique hyperspectral vision system solutions.
"Comprehending the invisible" - this means that with the help of DIVE inspection systems you can capture previously hidden quality features of wafer surfaces, thereby improving manufacturing qualities, increasing yields and reducing production costs.
Application areas
Products and services
◦
◦
◦
◦
Contact
DIVE imaging systems GmbH
Contact request