DIVE imaging systems GmbH opens a new chapter of quality control in semiconductor manufacturing with its Hyperspectral Vision system solutions. The Hyperspectral Vision Devices enable non-invasive, non-contact, two-dimensional measurements of wafer surfaces and their thin film topology, for both micro and macro inspection.

As a spin-off of the Fraunhofer IWS, DIVE synergetically combines hardware, software and AI-based algorithms to create unique hyperspectral vision system solutions.

"Comprehending the invisible" - this means that with the help of DIVE inspection systems you can capture previously hidden quality features of wafer surfaces, thereby improving manufacturing qualities, increasing yields and reducing production costs.