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OptiMel Schmelzgußtechnik GmbH

Low Pressure Moulding – electronics encapsulation

Axxon Europe B.V.

High-productivity, high-precision THT bonding system

Hubert Stüken GmbH & Co. KG

Deep Drawing out of Metal

SCREEN SPE Germany GmbH

Wafer Pattern Inspection System ZI-3600

VX Instruments GmbH

Dynamic High Power Semiconductor Testsystem DTS8765neo

SCREEN SPE Germany GmbH

Coat/Develop Track System RF-200EX

Yamaha Robotics

YRP10

Salvia Group GmbH

Cleanroom & Facility Solutions

Werner Lieb GmbH

Equipment Front End Modul (EFEM)

MIVA Technologies GmbH

Direct Imager 2200L DI

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