System-in-Package (SiP), Multi-chip modules, 3D integration
System-in-Package (SiP), Multi-chip modules, 3D integration (6 exhibitors)
12489 Berlin, Germany
Smart micro and optoelectronics
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging and Plating solutions.
12681 Berlin, Germany
High-accuracy micro assembly equipment for semiconductor R&D and production.
4500 Solothurn, Switzerland
Milledgeville, GA 31061, USA
TopLine presents CCGA packages for requiring very high-density interconnections.
8800 Thalwil, Switzerland
http%3A%2F%2Fexhibitors.productronica.com%2F%2Fprj_223%2Fview%2Findex.cfm%3Fnv%3D10.1%26lng%3D2%26clgk%3D2_4.4.4