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Electrical contacting (Flip chip, bonding, etc.) (3 exhibitors)

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Hesse GmbH
33104 Paderborn, Germany
Hesse GmbH – leading producer of ultrasonic bonding and welding machines
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Pac Tech - Packaging Technologies GmbH
14641 Nauen, Germany
Advanced wafer plating, packaging & solder ball placement equipment
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pb tec solutions GmbH
63755 Alzenau, Germany
Your specialist for standard and special solutions for SMT and assembly
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