Exhibitor portal
Assembly and packaging technology, system integration (5 exhibitors)
all | F | H | P
all
F
H
P
F
01277 Dresden, Germany
Functionalized ceramics and technologies for electronics and microsystems.
H
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33104 Paderborn, Germany
Hesse GmbH – leading producer of ultrasonic bonding and welding machines
P
14641 Nauen, Germany
Advanced wafer plating, packaging & solder ball placement equipment
63755 Alzenau, Germany
Your specialist for standard and special solutions for SMT and assembly