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Ultrasonic bonders (8 exhibitors)

 
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F
Finetech GmbH & Co.KG
12681 Berlin, Germany
High-accuracy micro assembly equipment for semiconductor R&D and production.
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F & K DELVOTEC Bondtechnik GmbH
85521 Ottobrunn, Germany
F & K DELVOTEC: Manual or automated Wire Bonders up to Laserbonders
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H
Hesse GmbH
33104 Paderborn, Germany
Hesse GmbH – leading producer of ultrasonic bonding and welding machines
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J
JFP Microtechnic
91460 Marcoussis, France
Wire-Bonder, Die-Bonder, Scriber, Manual/Semi-Automatic Micro-Placer
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K
Kulicke & Soffa Pte. Ltd.
554369 Singapore, Singapore
K&S is a leading provider of semiconductor and electronics assembly solutions.
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S
Systech Europe GmbH
40547 Düsseldorf, Germany
Microelectronics & Test Solutions
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T
TPT Wire Bonder GmbH & Co. KG
85757 Karlsfeld, Germany
Developing and manufacturing of wire bonders with over 30 years of experience
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Dr. Tresky AG
8800 Thalwil, Switzerland
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