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Bonders, miscellaneous (12 exhibitors)

 
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B
BESI BE Semiconductor Industries N.V.
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging and Plating solutions.
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H
Hesse GmbH
33104 Paderborn, Germany
Hesse GmbH – leading producer of ultrasonic bonding and welding machines
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I
Infotech AG
4500 Solothurn, Switzerland
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J
JFP Microtechnic
91460 Marcoussis, France
Wire-Bonder, Die-Bonder, Scriber, Manual/Semi-Automatic Micro-Placer
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K
Kaijo Shibuya Europe GmbH
65205 Wiesbaden, Germany
Kaijo wire bonding machines and ultrasonic cleaner for high purity wet process.
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M
MRSI Systems
01876 Tewksbury, MA, USA
High speed, high precision, flexible die bonders for all markets
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P
Pac Tech - Packaging Technologies GmbH
14641 Nauen, Germany
Advanced wafer plating, packaging & solder ball placement equipment
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S
Systech Europe GmbH
40547 Düsseldorf, Germany
Microelectronics & Test Solutions
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T
TPT Wire Bonder GmbH & Co. KG
85757 Karlsfeld, Germany
Developing and manufacturing of wire bonders with over 30 years of experience
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Dr. Tresky AG
8800 Thalwil, Switzerland
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Tresky GmbH
16761 Hennigsdorf, Germany
Die Bonder for assembly and packaging technology – “Made in Germany”
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U
UNITEMP GmbH
85276 Pfaffenhofen, Germany
Heat treatment of semiconductor material, reflow soldering, wire bonding
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