Flip-chip bonders (9 exhibitors)
all | B | F | I | J | M | P | Q | T
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging and Plating solutions.
12681 Berlin, Germany
High-accuracy micro assembly equipment for semiconductor R&D and production.
4500 Solothurn, Switzerland
91460 Marcoussis, France
Wire-Bonder, Die-Bonder, Scriber, Manual/Semi-Automatic Micro-Placer
Tewksbury, MA 01876, USA
High speed, high precision, flexible die bonders for all markets
14641 Nauen, Germany
Advanced wafer plating, packaging & solder ball placement equipment
6331 Hünenberg, Switzerland
JEDEC Tray and Waffle Pack Feeder - Bonding Systems - Testsockets
8800 Thalwil, Switzerland
16761 Hennigsdorf, Germany
Die Bonder for assembly and packaging technology – “Made in Germany”
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