Exhibitor portal
Flip-chip bonders
Flip-chip bonders (9 exhibitors)
all | B | F | I | J | M | P | Q | T
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B
F
I
J
M
P
Q
T
B
6921 RW Duiven, Netherlands
Discover Besi's ultimate Die Attach, Packaging and Plating solutions.
F
12681 Berlin, Germany
High-accuracy micro assembly equipment for semiconductor R&D and production.
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I
J
91460 Marcoussis, France
Wire-Bonder, Die-Bonder, Scriber, Manual/Semi-Automatic Micro-Placer
M
Tewksbury, MA 01876, USA
High speed, high precision, flexible die bonders for all markets
P
14641 Nauen, Germany
Advanced wafer plating, packaging & solder ball placement equipment
Q
T
16761 Hennigsdorf, Germany
Die Bonder for assembly and packaging technology – “Made in Germany”