From November 16 to 19, 2021 Viscom will be taking advantage of Munich-based productronica to exhibit a quite unique range of its inspection technologies including state of the art solutions for the continuous statistical monitoring of individual manufacturing steps and support for standards such as IPC HERMES 9852 und IPC CFX.
"We used the period of the pandemic to advance our innovations even further. During this time we concentrated in particular on the many and varied requirements in the field of 3D inline X-rays which is becoming increasingly important. As a consequence, we can now present some extremely sophisticated results in the area", stated Torsten Pelzer, Vice President Sales of Viscom AG. The new Viscom iX7059 generation of inline X-ray systems covers a broad spectrum of current and future requirements with, as one of its special features, flexible inspection concepts that have a much wider application than classic printed circuit boards. The innovative dynamic 3D Evolution 5 imaging technology enables several hundred X-ray images to be captured from a number of different viewpoints in just a few seconds to obtain an unambiguous three-dimensional analysis.
Viscom will also be presenting the S3088 DT at productronica as a representative of its much sought-after 3D AOI and 3D SPI range. The compact system is designed for dual track operation and can be easily adjusted to a variety of track widths. It can also be used as a single-track version in which case it is able to inspect even the largest of printed circuit boards.
Furthermore, the Viscom system S6056BO will be used to demonstrate the particularly advanced developments in the area of 3D wire bond inspection. These latest advances enable important additional information about the actual product quality to be gathered both for thick and thin wires and can be employed very effectively in automated production lines.