REK Innovation GmbH, a German based manufacturer of equipment for the semiconductor and electronics industry, announced today its new SC-350 vacuum reflow oven. The base of the SC-350 is a versatile single chamber processing core for various applications. At first emphasis is on reflow soldering for die-attach (i.e. IGBT, power LED, laser bars, MEMS etc.). The system has already proven its capabilities in large area substrate soldering (DCB and AMB) for power modules. This application requires enormous process flexibility and performance in order to control and avoid shrinkage voids.
SC-350 offers a variety of process options. Beside standard operation with formic acid as an oxide reducing agent, a hydrogen safety system, solder paste or high vacuum operation can be implemented additionally. In combination with the forward-looking software architecture, the system features great potential for the customers to reduce the time to market of their products.
“In this platform, we have implemented decades of experience in packaging technology. With the launch, we successfully completed the first milestone of our technology roadmap”, says Dr.-Ing. Ventzeslav Rangelov, Managing Director and Head of R&D at REK Innovation GmbH.
About REK Innovation GmbH
REK Innovation GmbH was established in 2020 and has its headquarters in Munich, Germany. The company develops and manufactures equipment for the electronic packaging and offers consulting services, support and maintenance. The founder team has been working over 15 years together on many various projects for front- and back-end applications. The company features mechanical and electrical design, software development, manufacturing and service. All these components in one house offer high efficiency and flexibility and shorten the time to market.
Dr.-Ing. V. Rangelov
Phone: +49 89 12226655