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Automation in X-ray Inspection with Computed Laminography

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YXLON develops and manufactures digital X-ray and CT systems that provide detailed insights into the finest structures, especially in the microfocus range for quality control in the electronics industry. Whether semiconductor packaging, BGA solder joints on printed circuit boards, sensors, or relays - with 2D or 3D X-ray inspection, missing or damaged bonding wires, faulty soldering or bonding joints, and other manufacturing defects can be detected, and their position and size defined according to requirements. Computed laminography can be used to create detailed 3D volumes of multilayer components, faster and more efficiently than conventional computed tomography.

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