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Tresky GmbH

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Die Bonder for assembly and packaging technology – “Made in Germany”

Company profile

TRESKY GmbH is one of the world's leading companies for high-precision placement machines with more than 40 years of experience in the semiconductor industry.
We offer our customers innovative and customized solutions for high-precision placement of electronic semiconductor devices, including epoxy, eutectic, flip chip and ultrasonic die bonding. Our T-6000 and T-8000 series DIE bonders provide highly flexible solutions.
Continuous product development at TRESKY GmbH is a high priority. This allows us to remain ahead of the market requirements and provide unique solutions. The multifunctional machine concept and numerous modular options enable our customers to react as quickly as possible to new technologies and product requirements.

Contact

Tresky GmbH
Neuendorfstr. 19 B, 16761 Hennigsdorf, Germany
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Mr. Ralf Urlass
Vertrieb
Tresky GmbH