PARMI Co. is the world's leading supplier of high end 3-D SPI and 3-D AOI systems that use dual laser triangulation. The laser triangulation is the superior alternative to conventional Moiré technology. Advantages are the shadow-free, highly accurate and fully textured 3-D images: Measurement of components up to a height of 40 mm with a resolution of up to 3.5 μm in x and y and 0.1 μm in z-direction are unique. The smooth movement of the sensor head during the scan, without abrupt stop & go for image capture, ensures noise-free images and a long-lasting and reliable stability of the system. Recently, the product portfolio was supplemented by inspection systems for wafer and wire bond inspection and conformal coating inspection systems with integrated thickness measurement.