Exhibitor portal
Wire-Bonder, Die-Bonder, Scriber, Manual/Semi-Automatic Micro-Placer
Company profile
JFP activities are dedicated to the manufacture of Wire & Die Bonders and integrated solutions as well. Modular platforms for laboratory and industry.
Product presentations
Semi-automatic Wedge & Ball Bonder WB-200-E
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Application areas
Products and services
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Main exhibitor
AMADYNE GmbH
Contact
JFP Microtechnic
1, rue du Fond des Prés, 91460 Marcoussis, France
+33 1
Contact request
Contact sales
Mr. Francois Palomares
Contact sales
Mr. Didier Magne
Sales
Applications and Sales Engineer
JFP MICROTECHNIC