Exhibitor portal
Mobile Navigation

DISCO HI-TEC EUROPE GmbH

DISCO HI-TEC EUROPE GmbH
SEMICON Europa
Add to my favorites
 
Total solutions for dicing, grinding and polishing of semiconductor wafers

Company profile

DISCO is a leading solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We develop and manufacture precision dicing, grinding and polishing machines as well as dicing blades and grinding/polishing wheels. Ablation laser and stealth laser dicing saws, plasma processing and tape mounting equipment are also available from us.

Our unique advantage is that we can provide you with not only machines and consumables, but also the total process solutions based on our wide range of application experiences.

Dicing Grinding Service and Camtek optical inspection service (AOI) are available at our Munich office.

Product presentations

Product overview

Product overview

Contact

DISCO HI-TEC EUROPE GmbH
Liebigstr. 8, 85551 Kirchheim b. München, Germany
Contact request
LinkedIn
Contact sales
Sales Department
DISCO HI-TEC EUROPE GmbH