Chip Integration Technology Center (CITC) is a non-profit joint innovation center that specializes in heterogeneous integration and advanced packaging technology for chips. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.

Access to Innovation
Our program lines focus on:

• Thermal High-Performance Packaging
• RF Chip Packaging
• Digital Package Manufacturing
• Integrated Photonics Packaging

Access to Infrastructure
We maintain lab facilities that support the innovation programs and support the education programs.

Access to Education
We support and provide packaging and chip integration technology related education.