With over 30 years experience in the Semiconductor industry, RECIF Technologies is acknowledged as expert in wafer handling. In the south west of France, we design, manufacture and distribute fully automated atmospheric handling equipments; wafer sorters and Equipment Front End Modules (EFEMs).

Dedicated to worldwide customer’s satisfaction, we are established in the main electronic industry regions to ensure proximity (USA, Asia, and headquarters in France).

From standard 300mm Silicon wafers to leading packaging substrates (for 3D-IC, TSV, FO-WLP), we are supporting chip manufacturing at the most advanced nodes.

Our COMPACT^G5+ & SMART equipments have been designed to meet SEMI standards and customers requirements with robust robotics and spotless handling.