ePAK is a full-service designer, manufacturer and supplier of precision engineered products and solutions for the automated transport and handling of semiconductor and electronic devices. Our product areas include front-end wafer handling, back-end IC transport, and end-system sub-assembly handling.

Our products are sold globally to top tier global customers including semiconductor companies, system OEMs, and IC assembly and test operations. ePAK’s executive team is positioned in key locations around the globe and we maintain nine sales and applications engineering offices worldwide supported by our world class manufacturing and design center in Shenzhen, China.

From Front End all the way to Final Packaging, we are there to help our customers succeed.