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We are a worldwide leading institute for microelectronic wafer level packaging.


Fraunhofer IZMs center »All Silicon System Integration Center Dresden – ASSID« was established in 2010 and is integral part of Fraunhofer IZMs wafer level system packaging and system integration. Fraunhofer IZM-ASSID operates a state-of-the-art 300 mm process line for 3D wafer level system integration based on Cu-Through Silicon Via (Cu-TSV) technology. Constituent parts of the line are individual process modules for TSV formation, for TVS post-processing as well as assembly and 3D stacking. The process line allows an application oriented development of 3D wafer level processes as well as the qualification and prototype manufacturing for 3D wafer level System in Packages, CSP, e.g.