F&K Physiktechnik GmbH recognizes itself, with more than 19 years of experience in the development and manufacturing of products and processes for chip interconnection in microelectronic, as a system supplier for all users of ultrasonic bonding technology. Customers worldwide are using F&K Physiktechnik's generators and transducers to realize their projects in ultrasonic wire and die bonding. In addition to this, we offer test and measurement equipment to characterize and set up ultrasonic systems of bond machines.
Product lineup & services:
Ultrasonic Transducer (standard & customized), Ultrasonic Generators (standard & customized), Optical Displacement Measurement Systems (vibrometer), Bond Force Calibration Systems, Vibration measurements (on-site & in house)