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Boschman Advanced Packaging Technology

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Specialized in sintering and molding solutions for Power, MEMS and Sensors.

Unternehmensprofil

Boschman is a high-tech, engineering driven Dutch company focusing on advanced back-end semiconductor packaging solutions;

We provide a unique one-stop-shop concept, from idea to industrialization, for semiconductor packaging activities:

1.  Package Development Services

2.  Assembly & Test Services

3.  Industrial Assembly Equipment

We are a focused on well-defined high growth market segments incl. Power Electronics (Automotive, Smart Grid and Industrial), MEMS and Sensors.

We focus on these opportunities with technology leadership in Pressure Sintering and Advanced Molding, supported by our Patented Technology (DIT, FAM, TPV,…) and unique, unparalleled packaging expertise.

Kontaktdaten

Boschman Advanced Packaging Technology
Stenograaf 3, 6921 EX Duiven, Niederlande
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